专利名称:Acoustic resonator and method of
manufacturing the same
发明人:Sang Uk Son,Duck Hwan Kim,Jea Shik
Shin,Yeong Gyu Lee,Chul Soo Kim,Moon ChulLee,Ho Soo Park,Jie Ai Yu
申请号:US14638529申请日:20150304公开号:US09787280B2公开日:20171010
专利附图:
摘要:There is provided an acoustic resonator including: a resonance part including a
first electrode, a second electrode, and a piezoelectric layer interposed between the firstand second electrodes; and a substrate provided below the resonance part, wherein thesubstrate includes at least one via hole penetrating through the substrate and aconnective conductor formed in the via hole and connected to at least one of the firstand second electrodes. Therefore, reliability of the connective conductor formed in thesubstrate may be secured.
申请人:SAMSUNG ELECTRO-MECHANICS CO., LTD.
地址:Suwon-Si KR
国籍:KR
代理机构:NSIP Law
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