专利名称：Integrated circuit package and method
having wire-bonded intra-die electricalconnections
发明人：Ivor Barber申请号：US10819684申请日：20040406
公开号：US200502249A1公开日：20051013
专利附图：
摘要：A semiconductor package having a substrate mounted die. The die configuredhaving active circuit components and a top surface having bond pads electrically
connected with circuitry of the die. The bond pads commonly being formed above activecircuit components. The bond pads being electrically interconnected with wire bonds toestablish intra-chip electrical connection between circuitry of the die. Methods of formingsuch packages are also disclosed.
申请人：Ivor Barber
地址：Los Gatos CA US
国籍：US
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