PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME

专利名称：PACKAGE SUBSTRATE AND METHOD OF

FORMING THE SAME

发明人：Yu-Hua CHEN,Wei-Chung LO,Dyi-Chung

HU,Chang-Hong HSIEH

申请号：US13966045申请日：20130813

公开号：US20140117557A1公开日：20140501

专利附图：

摘要：A package substrate and a method for forming the package substrate aredisclosed. The package substrate includes an interposer having a plurality of conductive

through vias and a first insulating layer formed on the sidewalls of the conductivethrough vias, a second insulating layer formed on one side of the interposer, and aplurality of conductive vias formed in the second insulating layer and electricallyconnected to the conductive through vias. By increasing the thickness of the first

insulating layer, the face diameter of the conductive through vias can be reduced, and thelayout density of the conductive through vias in the interposer can thus be increased.

申请人：UNIMICRON TECHNOLOGY CORPORATION,INDUSTRIAL TECHNOLOGYRESEARCH INSTITUTE

地址：Taoyuan TW,Hsinchu TW

国籍：TW,TW

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