Semiconductor device packages, packaging methods,

专利名称：Semiconductor device packages, packaging

methods, and packaged semiconductordevices

发明人：Jie Chen,Ying-Ju Chen,Hsien-Wei Chen申请号：US15353334申请日：20161116公开号：US09991247B2公开日：20180605

专利附图：

摘要：Semiconductor device packages, packaging methods, and packagedsemiconductor devices are disclosed. In some embodiments, a package for a

semiconductor device includes an integrated circuit die mounting region and a moldingmaterial disposed around the integrated circuit die mounting region. An interconnectstructure is disposed over the molding material and the integrated circuit die mountingregion. A protection pattern is disposed in a perimeter region of the package. Theprotection pattern includes a conductive feature.

申请人：Taiwan Semiconductor Manufacturing Company, Ltd.

地址：Hsin-Chu TW

国籍：TW

代理机构：Slater Matsil, LLP

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