ｗｗｗ．ｓｚａｋｌ．ｃｏｍDocument No. ME-01-02-005
SPECIFICATION
MEMS Microphone
RoHS Compliance & Halogen Free
Product : 3.76x2.95x1.1mm Analog Top Port + MAXRF GETTOP P/N :
ＡＬＫ－ＢＦＡ４２３－０１
Version : V2.0
Designed by
Checked by
Confirmed by
Approved by Released Date
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍRevision History
Date Version 3-20-2013 11-25-2013
Description Controller Mary Lee Mary Lee
V1.0 V2.0
Updated to new format, updated THD Format updated
1
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍContents
1. Scope .................................................................................................................................... 3 2. Product Type ....................................................................................................................... 3 3. Electro-Acoustic Specifications ......................................................................................... 3 4. Frequency Response .......................................................................................................... 4 5. Measurement System Setup ............................................................................................... 5 6. Dimension ............................................................................................................................ 6 7. Reliability Tests ................................................................................................................... 6
7.1 7.2 7.3 7.4 7.5 7.6 7.7
Hi-Temperature Test ...................................................................................................................... 6 Low-Temperature Test .................................................................................................................. 6 Humidity & Heat Test .................................................................................................................... 6 Thermal Shocking Test ................................................................................................................. 7 Vibration Test ................................................................................................................................ 7 Drop Test ....................................................................................................................................... 7 Electrostatic Discharge ................................................................................................................. 7
8. Packaging ............................................................................................................................ 8 9. Application Design Suggestions ........................................................................................ 9
9.1 9.2 9.3
Recommended PCB Design ......................................................................................................... 9 Temperature Profile during Reflow Process .................................................................................. 9 Recommended Pick-up Area ...................................................................................................... 10
10. Special Cautions ............................................................................................................. 10
Air Rifle Cleaning Restriction ...................................................................................................... 11 Board Wash Restriction .............................................................................................................. 11 Vacuum Restriction ..................................................................................................................... 11 Environmental Condition ............................................................................................................. 11 Storage ....................................................................................................................................... 11
10.1 10.2 10.3 10.4 10.5
11. References ...................................................................................................................... 11
2
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍ1. Scope
This document is the technical specification of a MEMS microphone.
2. Product Type
Product Number:
ＡＬＫ－ＢＦＡ４２３－０１Product Description:
3.76x2.95x1.1mm Analog Top Port. With MAXRF protection.
3. Electro-Acoustic Specifications
Test condition: +20℃, 45%～75% RH, 86~106Kpa, Vdd=2V, unless specified differently.
Table 3-1 Electrical Specifications
No. Parameter Symbol Condition 3.1 Sensitivity 3.2 Directivity 3.3 3.4
Output
Impedance Current Consumption
f=1kHz, Pin=1Pa,
S 0dB=1V/Pa
Limits
Min Nom. Max Unit
-45 -42 -39 dB Omni-directional ZOUT f=1kHz 200 Ω IDSS
1.5V to 3.3V
90
250
µA
f=1kHz, Pin=1Pa,
3.5 S/N Ratio S/N (A-Weighted) 3.6 Operating Voltage3.7 3.8
Sensitivity vs.
Voltage Total Harmonic Distortion
ΔS THD
Vs= 3.3V to 1.5V 100dB SPL @1KHz115dB SPL @1KHz
59 dB 1.5 2 <0.5
1 5 3.3 V dB %
3
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍ4. Frequency Response
Relative Response( dB)+20
+15+10+50-5-10-15-20
50
100
200
500
Frequency (Hz)
-2-2-2-2-2-2+2+2+2+2+3+71k3k5k10k
Fig. 4-1 Frequency Response
Table 4-1 Frequency Response Limit Template
Frequency
[Hz] Upper Limit
[dB] Lower Limit [dB]
100 200 500 3K 5K 8K 2 2 2 2 3 7 -2 -2 -2 -2 -2 -2 * Limits for intermediate frequencies are found by drawing straight lines between the breaking points in the table on a linear dB – logarithmic frequency scale.
4
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍ5. Measurement System Setup
Test signal: Sinusoid, Sweep, Frequency Range: 50Hz-17KHz Step: 1/12 octave B&K 3560C
Transfer data through transmission line
Anechoic
chamber
Output Input
Turn-table controller
B&K4191 L001
Free field 1/2 inch MIC DUT MIC
Free field 50cm
Tannoy Speaker
2716C-001 Audio amplifier
Fig. 5-1 Measurement System Setup
5
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍ6. Dimension
xxxxDateCodeBOTTOM VIEWTOP VIEW
Unmarked Tolerance: ± 0.1 (mm)
Pad definition: 1--OUTPUT 2-- GND 3--GND 4-- VDD
Fig. 6-1 Dimension
7. Reliability Tests
All the test conditions of the Reliability Tests are specified in the reference document,
listed in Section 12.
After conducting any of the following tests, the sensitivity change of DUT shall be less than ±3dB from its initial value and shall keep its initial operation and appearance. 7.1 Hi-Temperature Test
Temperature: +85℃ Duration: 240 hours
7.2 Low-Temperature Test Temperature: -40℃ Duration: 240 hours
7.3 Humidity & Heat Test
Temperature: +70℃ Humidity: 93% RH Duration: 240 hours
6
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍ7.4 Thermal Shocking Test Temperature & Duration: -40℃, 30 minutes
Temperature & Duration: +80℃, 30 minutes, Cycles: 32 cycles 7.5 Vibration Test
Frequency: 10-55Hz Amplitude: 1.52mm Direction: 2 directions Duration: 2 hours 7.6 Drop Test Drop the microphones to the floor without package. Height: 1.5m
Reference Surface: slippery marble floor Duration: 5 times
7.7 Electrostatic Discharge The tests are performed acc. to IEC61000-4-2 level 3:
a. Contact Discharge Discharge Position: Output of Microphone Charge Voltage: ±6000VDC
Discharge Network: 150pF & 330Ω
b. Air Discharge Discharge Position: Sound Hole Charge Voltage: ±8000VDC
Discharge Network: 150pF & 330Ω
7
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍ8. Packaging
* Use ESD reel and tape for microphone packaging.
* Anti-static measures should be applied during packaging operation.
8.0±0.14.0±0.11.75±0.14.0±0.1B1.23±0.050.3±0.05AA12±0.3SOUND PORT5.5±0.05BBB120°3.25±0.0510°MAX220.4.05±0.05AA13-0.2+0.52.4±0.1A(10:1)330MAX18.4MAX100±0.5012.4 0+2A
Tape and Reel Batch Box Shipping Box
φ330mm 5,500PCS×1=5,500PCS 120mm*350mm*365mm
5,500PCS×5=27,500PCS
265mm*375mm*400mm 27,500PCS×2=55,000PCS Fig. 8-1 Packaging
8
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍ9. Application Design Suggestions
9.1 Recommended PCB Design:
1.74-0.82.46
Fig. 9-1 Recommended PCB Design
9.2 Temperature Profile during Reflow Process：
Table 9-1 Temperature Profile during Reflow Process
Parameter
Average Temperature Gradient in Preheating Soak Time Time above 217°C Time above 230°C Time above 250°C
Peak Temperature in Reflow Temperature Gradient in Cooling
Reference
Tsoak t1 t2 t3 Tpeak
Specification 2.5°C/s 2-3 minutes Max 60s Max 50s Max 10s 255°C (–0/+5°C) Max -5°C/s
9
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍTemperatureNot to scale, for reference only Tpeak
T3T2T1tsoakt3t2t1Time
Fig. 9-2 Reflow Profile
*After the initial reflow, the MIC shall be resumed to room temperature if more reflow is needed.
*The test should be conducted after the MIC unit has been exposed to room temperature for 3 hours.
9.3 Recommended Pick-up Area:
Pick-up Area0.30.31.180.50.3
Fig. 9-3 Recommended Pick-up Area
10
Ｓｈｅｎ Ｚｈｅｎ ＡＬＫ Ｅｌｅｃｔｒｏｎｉｃｓ ＣＯ．，ＬＴＤ
ｗｗｗ．ｓｚａｋｌ．ｃｏｍ10. Special Cautions
10.1 Air Rifle Cleaning Restriction Do not bring air rifle to the port hole directly. Recommended Condition:
Air pressure < 0.3MPa; Distance > 5cm; Time < 5 sec.
10.2 Board Wash Restriction
It is prohibited to wash the board after reflow process. This could damage the MIC. 10.3 Vacuum Restriction
It is prohibited to use a vacuum over the port hole of the MIC. This could damage the MIC.
10.4 Environmental Condition
Storage Condition: -40℃~+100℃, R.H. < 90% Operation Condition: -40℃~+100℃, R.H. < 90%
Arbitration Condition: 20℃±1℃, R.H. 63%~67%, Air pressure: 86~106KPa 10.5 Storage
The component needs to meet the requirement of MSL(Moisture Sensitivity Level) class 2a. Please keep MICs in warehouse with humidity less than 75% and without sudden temperature change, acid air, and any other harmful air or strong magnetic field. Please protect products against moist, shock, sunburn and pressure. Please take proper measures against ESD in the process of assembly and transportation..
Please use the shipping package for long-term storage.
11. References
1) “Reliability Test Manual at Shandong Gettop Acoustic Co. Ltd.”, SM-III-S080-04-E.
11
因篇幅问题不能全部显示，请点此查看更多更全内容