Printed circuit board with aligned connections and

专利名称：Printed circuit board with aligned

connections and method of making same

发明人：Christina M. Boyko,Francis J. Bucek,Richard

W. Carpenter,Voya R. Markovich,DarleenMayo,Cindy M. Reidsema,Joseph G. Sabia

申请号：US08/195532申请日：19940214公开号：US050290A公开日：19950912

摘要：The present invention provides an improved circuit board for mountingintegrated circuit chips and a technique for manufacturing the circuit board. The boardpermits direct chip attachment to the circuit board by providing the necessary geometryfor the footprint pattern of the chip connections without the necessity of multi-levelpackaging using chip carriers. The circuit board includes a substrate with plated throughholes, and a film of photoresist dielectric material disposed on the substrate. Thedielectric material is photo patterned to form vias which are then filled with conductivematerial. Electrical connection pads are formed on the exposed surface of the film ofdielectric material in the pattern of the chip footprint to be mounted thereon. The viasand plated through holes are arranged in groups and patterns which provide some directconnection between the pads and plated through holes, some pads wired to vias on theexposed surface of the film of dielectric material and some vias wired to plated throughholes on the surface of the substrate.

申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION

代理机构：Calfee, Halter & Griswold

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