专利名称:INTEGRATED CIRCUIT AND METHOD OF
MANUFACTURING THE SAME
发明人:Andreas Thies,Klaus Muemmler申请号:US12174434申请日:20080716
公开号:US20100013047A1公开日:20100121
专利附图:
摘要:An integrated circuit on a substrate comprises a buffer capacitor in a bufferregion. The buffer capacitor comprises a buffer electrode arranged at least partially in arecess, and a dielectric layer disposed between the buffer electrode and the substrate.
申请人:Andreas Thies,Klaus Muemmler
地址:Berlin DE,Dresden DE
国籍:DE,DE
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