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INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE

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专利内容由知识产权出版社提供

专利名称:INTEGRATED CIRCUIT AND METHOD OF

MANUFACTURING THE SAME

发明人:Andreas Thies,Klaus Muemmler申请号:US12174434申请日:20080716

公开号:US20100013047A1公开日:20100121

专利附图:

摘要:An integrated circuit on a substrate comprises a buffer capacitor in a bufferregion. The buffer capacitor comprises a buffer electrode arranged at least partially in arecess, and a dielectric layer disposed between the buffer electrode and the substrate.

申请人:Andreas Thies,Klaus Muemmler

地址:Berlin DE,Dresden DE

国籍:DE,DE

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