专利名称：INTEGRATED CIRCUIT AND METHOD OF
MANUFACTURING THE SAME
发明人：Andreas Thies,Klaus Muemmler申请号：US12174434申请日：20080716
公开号：US20100013047A1公开日：20100121
专利附图：
摘要：An integrated circuit on a substrate comprises a buffer capacitor in a bufferregion. The buffer capacitor comprises a buffer electrode arranged at least partially in arecess, and a dielectric layer disposed between the buffer electrode and the substrate.
申请人：Andreas Thies,Klaus Muemmler
地址：Berlin DE,Dresden DE
国籍：DE,DE
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