Adhesive film and method of encapsulating organic

专利名称：Adhesive film and method of encapsulating

organic electrode device using the same

发明人：Hyun Jee Yoo,Yoon Gyung Cho,Jung Sup

Shim,Suk Chin Lee,Kwang Jin Jeong,Suk KyChang

申请号：US13886098申请日：20130502公开号：US08742411B2公开日：20140603

专利附图：

摘要：An adhesive film, and a product and method of encapsulating an organic

electronic device (OED) using the same are provided. The adhesive film serves toencapsulate the OED and includes a curable hot-melt adhesive layer including a curableresin and a moisture absorbent, and the curable hot-melt adhesive layer includes a firstregion coming in contact with the OED upon encapsulation of the OED and a secondregion not coming in contact with the OED. Also, the moisture absorbent is present atcontents of 0 to 20% and 80 to 100% in the first and second regions, respectively, basedon the total weight of the moisture absorbent in the adhesive layer.

申请人：LG Chem, Ltd.

地址：Seoul KR

国籍：KR

代理机构：McKenna, Long & Aldridge, LLP.

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